Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will moderate two expert panels at International Conference for Electronics Enabling Technologies (ICEET) from June 5-7, in Markham, Ontario, Canada.
Sandy-Smith will moderate the Warpage Induced Defects and Component Warpage Limits panel. This panel features professionals from Plexus, Rockwell Collins, and Akrometrix.
Sandy-Smith will also moderate the Low-Melting Point Solder Pastes panel. Panelists will include Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, along with professionals from Alpha Assembly Solutions and Nihon Superior.
Sandy-Smith will also present Process and Materials Interaction Investigation: Or How to Measure Post-Process Assembly Surface Reliability.
Sandy-Smith is an industry leader renowned for her technical knowledge and support. As a Technical Support Engineer based at Indium Corporation’s headquarters in Clinton, NY, she specializes in PCB Assembly Materials and works closely with customers to develop custom solutions and optimize their processes. Sandy-Smith has a passion for developing and implementing standardization for test methods and is an SMTA Certified Process Engineer. She is active in several IPC committees, SMTA programs, and iNEMI projects, and currently serves as Chair of the J-004 committee and as Vice President of technical programs for the SMTA Empire chapter. She graduated from the International Engineering Program at the University of Rhode Island with a degree in chemical engineering and German language.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、最先端の材料を製造・供給する主要企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
