Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics Symposium (Pan Pac 2025), taking place January 27-30 in Maui, Hawaii.
Dr. Lasky’s first presentation, Electronics: Down Memory Lane and a Vision for the Future, will explore the evolution of electronics, from early vacuum tube technology to modern innovations such as artificial intelligence and robotics. Dr. Lasky will highlight key milestones of technology’s rapid advancements throughout history and discuss how the optimization of resources and advanced AI integration are streamlining and shaping the future of electronics.
The second presentation, titled Low-Temperature Attach: Today and Tomorrow, will focus on advancements in low-temperature soldering technologies, including bismuth-tin alloys and metastable solder pastes. These innovations enable secure interconnections at significantly lower temperatures – crucial for next-generation electronics requiring delicate material handling and enhanced performance.
“For over a century, electronics innovation has been the cornerstone of our ever-evolving tech industry,” said Dr. Lasky. “At Pan Pac, I look forward to discussing the advancements that have brought us to this point, and the promising future ahead.”
Brennan’s presentation, Mastering Complexity: A Solder Material Solution to Manage Component Warpage and Uneven Thermal Gradients in Modern Electronics Manufacturing, addresses the challenges posed by larger, more complex integrated circuit chips and high-density circuit boards, including component warpage and uneven heating during reflow processes. Brennan will highlight the use of a novel, low-temperature alloy that reduces peak reflow temperatures by 20-40°C compared to SAC305. This solution effectively mitigates warpage and enhances manufacturing reliability for modern electronics.
About Indium Corporation
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」をwww.linkedin.com/company/indium-corporation/ でフォローすることもできます。
