Indium Corporation is pleased to announce that Brian Rundell has joined the company as a Technical Support Engineer based at the companys headquarters in Clinton, New York.
Rundell is responsible for providing technical assistance to current and potential customers to resolve soldering process-related issues. This includes assisting with the optimization of Indium Corporations soldering materials in addition to providing product and process training.
Rundell brings more than 19 years of industry experience to Indium Corporation. Prior to joining the company, he spent ten years leading the manufacturing process development, qualification, and production support of circuit board assemblies for space and military applications. Some of his major accomplishments include directing efforts from prototype assembly through flight production on modules for the Navys Air and Missile Defense Radar system and Eutelsat Quantum communications satellite. He earned his bachelors degree in electrical engineering from Syracuse University and is a Six Sigma Green Belt.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
