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サーマル・カップル(TC)を使用したリフロー・プロファイルは、クロモトグラフィ(IC)やストレイン・ゲージ(SG)試験と同様に有用です。

The tremendous increase in the use of bottom terminated components (BTCs), some estimates are at more than 50 billion per year, have heightened the concern for minimizing voiding between the thermal

Folks, Let’s see how Patty is doing, it’s been a very, very long time… Even though Patty and her husband Rob both worked at Ivy University, they seldom drove in together. It was

皆さん、紀元前3500年頃の氷人エッツィに同情してください。銅の粒子と、銅鉱石に含まれる微量元素であるヒ素の両方が発見されたことから、彼は銅の製錬に携わっていたと考えられている。

Often times solder defects such as spattering, voiding, slumping/bridging, and tombstoning can be remedied just by adjusting the reflow profile. For this reason it is important to understand the

In my previous post on this topic, Stages of a Reflow Profile: Part II, I mentioned a few profile-induced soldering defects, including graping, tombstoning, and voiding. In this post,we will talk

Happy New Year everyone! Typically the new year signals a new beginning, but thispost will be concluding our series on reflow profilingby discussing the fourth stage of a reflow profile: the

Folks, Six months ago……. Patty had just finished an all day workshop on “Common Defects in SMT Assembly and How to Minimize Them." The workshop seemed to go really well, and

Folks, Patty really liked living in Woodstock, Vermont. She enjoyed the wildlife that literally came up to her kitchen