Indium6.4 Water-Soluble Solder Paste’s flux chemistry minimizes voiding under QFN and BGA assemblies. A typical water-soluble solder paste has approximately 15-30 percent voiding; however, Indium6.4 consistently yields less than five percent.
Indium6.4 provides:
- Fewer voids
- Smaller voids
- Good cleanability and reflow properties
- Exceptional response-to-pause printing
- Extended stencil life
- Exceptional slump resistance
Indium6.4 is manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100 (tin, lead, and silver). It joins Indium6.3 as one of Indium Corporation’s top-performing water-soluble solder pastes.
For more information on Indium6.4 and our other Indium Corporation solder pastes, visit www.indium.com/Indium6.4.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールをお送りください。
