Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.
The presentation, Engineering Out Defects: Solder Paste Selection and Handling Best Practices, will focus on solder paste selection, storage, and handling best practices for printed circuit board (PCB) assembly, and will connect the principles to the defect mechanisms they influence. Each best practice is an opportunity to prevent defects and promote a robust assembly process.
“Reliable PCB assembly starts long before the first print,” said Burt. “From the time the paste is manufactured to the moment it’s put on the stencil, disciplined handling protocols preserve and optimize performance.”
Burt is based at Indium Corporation’s global headquarters in Clinton, New York. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation’s materials, as well as providing product and process training. Burt earned his bachelor’s degree in chemistry from Clarkson University, and he is a Certified SMT Process Engineer (CSMTPE).
The presentation will take place on Wednesday, October 1, at 11:00 a.m.
To learn more about Indium Corporation’s innovative solder solutions, visit https://www.indium.com/.
インジウム・コーポレーションについて
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
