Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.
The presentation, Engineering Out Defects: Solder Paste Selection and Handling Best Practices, will focus on solder paste selection, storage, and handling best practices for printed circuit board (PCB) assembly, and will connect the principles to the defect mechanisms they influence. Each best practice is an opportunity to prevent defects and promote a robust assembly process.
“Reliable PCB assembly starts long before the first print,” said Burt. “From the time the paste is manufactured to the moment it’s put on the stencil, disciplined handling protocols preserve and optimize performance.”
Burt is based at Indium Corporation’s global headquarters in Clinton, New York. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation’s materials, as well as providing product and process training. Burt earned his bachelor’s degree in chemistry from Clarkson University, and he is a Certified SMT Process Engineer (CSMTPE).
The presentation will take place on Wednesday, October 1, at 11:00 a.m.
To learn more about Indium Corporation’s innovative solder solutions, visit https://www.indium.com/.
关于铟泰铟泰公司
铟泰公司®是面向全球电子、半导体、薄膜及热管理 顶级材料精炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
