Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.
The presentation, High Reliability and Low-Temperature Solder Solutions for AI and Automotive Application, will explore cutting-edge solder solutions designed to meet the demanding requirements of the evolving automotive and AI industries. Modern automotive electronics require robust solder solutions that can withstand extreme temperatures while maintaining long-term reliability. Meanwhile, AI applications demand solders compatible with High-Performance Computing (HPC) requirements, where thermal management during processing is critical.
Additionally, Chou will discuss Indium Corporation’s innovative Durafuse® LT and Durafuse® HR solder technologies. These solutions address two critical industry challenges: the need for high-reliability solder joints in high-temperature automotive environments and low-temperature processing solutions for complex AI computing modules.
“As the automotive and AI industries continue to push the boundaries of electronic performance, traditional solder solutions are no longer sufficient,” said Chou. “Durafuse® technology represents a significant breakthrough, offering solutions that handle both the intense heat of automotive applications and the precise, low-temperature requirements of AI processing.”
Chou is Indium Corporation’s senior area technical manager for the company’s customers in Taiwan, with a focus on the semiconductor industry. His strategic location in southern Taiwan provides timely customer response, as well as efficient sales and marketing team support. Chou has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology.
Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.
Visitors can view the presentation on Thursday, January 23, at 3:00 p.m. in East Hall 7. To learn more information on Indium Corporation’s solder solutions, visit or indiumstg.wpenginepowered.com/durafuse or speak to our experts at NEPCON Japan at booth E66-22.
About Indium Corporation
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」をwww.linkedin.com/company/indium-corporation/ でフォローすることもできます。
