As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Tuesday, March 18
- Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.
- This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing demonstrating up to a 67% reduction in voids under optimized reflow conditions.
Wednesday, March 19
- Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder, presented by Technical Support Engineer Thuy Nguyen, and co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling.
- This presentation explores the development of novel mixed-alloy solder paste Durafuse® HR, which reduces voiding while maintaining high-reliability thermal cycling performance, offering improved solutions for automotive, high-performance computing, and 5G communication applications.
- Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow presented by R&D Manager Dr. Ian Tevis, co-authored by Dr. Yifan Wu and Radhika Jadhav.
- This presentation showcases the development of supercooled solder pastes using core-shell bismuth-tin (BiSn) particles, enabling reliable solder interconnects at temperatures 40°C lower than conventional reflow profiles, making them ideal for future electronics manufacturing and temperature-sensitive applications.
- Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II, co-presented by Senior Product Specialist Miloš Lazić and Sunny Agarwal, ITW EAE. Co-authored by Dr. Ricky McDonough.
- This presentation examines the advancements in liquid metal paste (LMP) technology, showcasing its enhanced thermal conductivity and adaptability for high-performance computing applications, while addressing challenges associated with traditional liquid metal thermal interface materials (TIMs).
- Phase-Change Metal (PCM) TIMs for Enhanced Thermal Management – Part II, presented by Miloš Lazić, co-authored by Dr. Ricky McDonough and Bob Jahttps://www.indium.com/team/bob-jarrett/rrett.
- This presentation introduces newly developed gallium-based and gallium-free phase-change metal (PCM) TIMs, designed to remain in a liquid state at operating temperature, delivering exceptionally low thermal resistance. Power cycling and HAST data highlight their robust performance and underscore the necessity of containment strategies, while gallium-free solutions enable compatibility with aluminum heat-sinks.
To learn more about Indium Corporation’s solder and TIMs solutions, visit indiumstg.wpenginepowered.com or visit with our experts at APEX 2025 in booth #1416.
About Indium Corporation
インジウム・コーポレーション®は、世界のエレクトロニクス、半導体、薄膜、および熱管理市場向けに、素材の精製、製錬、製造、供給を行うトップクラスの企業です。 製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズなどの金属および無機化合物、ならびにNanoFoil®が含まれます。1934年に設立された同社は、世界的な技術サポート体制を整備しており、中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を構えています。
インジウム・コーポレーションに関する詳細については、indiumstg.wpenginepowered.comをご覧いただくか、[email protected] までメールでお問い合わせください。また、当社の専門家による「From One Engineer ToAnother®（#FOETA）」をwww.linkedin.com/company/indium-corporation/ でフォローすることもできます。
