Indium Corporation will feature its proven Indium3.2HF Solder Paste for LED manufacturing at Touch Taiwan Display International, August 28-30 in Taipei, Taiwan.
The use of high-power LEDs, MicroLEDs, and MiniLEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials. Indium Corporation's Indium3.2HF Solder Paste provides:
- Consistent printing performance
- Long stencil life
- Outstanding slump resistance
- Excellent wetting ability
- Superior fine-pitch soldering ability
- Water-washable flux residue
Indium Corporation also provides a myriad of materials for LED manufacturing, such as IndiTriTM or indium trichloride for manufacturing common MOCVD precursor materials, metal-based thermal interface materials (TIMs), gold-tin solder preforms and pastes,and ultra-low voiding solder pastes.
See Indium Corporation's experts at the show or visit indiumstg.wpenginepowered.com/LED to learn more.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
