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Indium Corporation to Feature Ultra-Low Voiding Indium10.1HF Solder Paste at Productronica China 2018
Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16,
Indium Corporation’s Sandy-Smith to Lead Expert Panel Discussion on Test Methods for Assessing Ionic Cleanliness at APEX 2
Indium Corporation’s Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the IPC APEX
Indium Corporation Senior Product Manager to Present at APEC 2018
Indium Corporation’s Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 in San Antonio, Texas. Dr.
Indium Corporation Features InFORMS Preforms and Reinforced Solder Ribbon at APEC 2018
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2018, March 4-8, in San Antonio, Texas. Indium Corporation is redefining solder with its
Indium Corporation Experts to Present at APEX 2018
Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif. Vice President
Indium Corporation Technical Support Engineer Presents at SMTA Space Coast
Indium Corporation Technical Support Engineer Kim Flanagan shared her expertise at the SMTA Space Coast Expo & Tech Forum on January 18 in Melbourne, Fla. Flanagan’s
Indium Corporation to Feature Ultra-Low Voiding Indium10.1HF Solder Paste at Productronica China 2018
Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16,
Indium Corporation Earns International Automotive Quality Recognition – ISO/TS 16949
Indium Corporation has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters. “SRI Quality System Registrar (SRI) is
Indium Corporation Technology Experts to Present at Pan Pacific Microelectronics Symposium 2018
Indium Corporation’s Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium 2018 (Pan
Indium Corporation Announces Inside Sales Team Changes
Indium Corporation, Utica’s Technology Company®, announces new additions and promotions within its Inside Sales Department. Lisa Clark has been named Inside Sales Assistant Manager.
Indium Corporation to Feature New Solder Paste for Fine Feature Printing at APEX 2018
Indium Corporation will feature Indium11.8HF-SPR Solder Paste a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of
Indium Corporation Promotes Brown to Associate Director, Marketing Communications
Indium Corporation has named Anita Brown as Associate Director, Marketing Communications. Brown is responsible for managing the strategic planning initiatives for the Marcom
Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018
Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on
Indium Corporation Logistics Expert Shares Indium Metal Supply and Demand at 2017 Global Minor Metals Forum in China
Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in
Indium Corporation’s Short and McCoy Recognized As CNY BEST by CNY Association for Talent Development
Indium Corporation proudly announces that Rick Short, Corporate Associate Vice President and Senior Director of Marketing Communications, and Jim McCoy, Talent Acquisition Supervisor,
Indium Corporation Features InFORMS Reinforced Solder Ribbon for Automated Assembly at NEPCON Japan 2018
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan. Indium Corporation is redefining solder with
Indium Corporation Announces New Corporate Leadership Greg Evans Named CEO, Ross Berntson Promoted to President and COO
Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.
Indium Corporation Announces Two New Hires
Indium Corporation, Utica’s Technology Company®, proudly announces the addition of two new members to its team. Eric Rightmier has joined Indium Corporation as Help Desk Technician. He is
Indium Corporation Names Hisert as Indium Applications Manager
Indium Corporation has named Jim Hisert as Indium Applications Manager. Hisert is responsible for exploring and leveraging the use of indium in various forms and applications. He will
Indium Corporation Offers One-Source Solution for High-Purity Tin (Sn) Metal Applications
Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or
Indium Corporation Experts to Present at Productronica 2017
Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria and Switzerland, and Karthik Vijay, Technical Manager, Europe, Africa and the Middle East, will
