新闻稿

Indium Corporation Technical Support Engineer Kim Flanagan shared her expertise at the SMTA Space Coast Expo & Tech Forum on January 18 in Melbourne, Fla. Flanagan’s

Indium Corporation will feature its new ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at Productronica China 2018, March 14-16,

Indium Corporation has been awarded ISO/TS 16949 management system certificates for two of its manufacturing facilities and company headquarters. “SRI Quality System Registrar (SRI) is

Indium Corporation’s Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium 2018 (Pan

Indium Corporation, Utica’s Technology Company®, announces new additions and promotions within its Inside Sales Department. Lisa Clark has been named Inside Sales Assistant Manager.

Indium Corporation will feature Indium11.8HF-SPR Solder Paste a new air and nitrogen reflow, no-clean, Pb-free solder paste designed to meet the fine feature printing requirements of

Indium Corporation has named Anita Brown as Associate Director, Marketing Communications. Brown is responsible for managing the strategic planning initiatives for the Marcom

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, will share her expertise at the 17th International Electronic Recycling Congress (IERC) 2018 event on

Indium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum on Nov. 29 in

Indium Corporation proudly announces that Rick Short, Corporate Associate Vice President and Senior Director of Marketing Communications, and Jim McCoy, Talent Acquisition Supervisor,

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at NEPCON Japan 2018, Jan. 17-19, in Tokyo, Japan. Indium Corporation is redefining solder with

Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.

Indium Corporation, Utica’s Technology Company®, proudly announces the addition of two new members to its team. Eric Rightmier has joined Indium Corporation as Help Desk Technician. He is

Indium Corporation has named Jim Hisert as Indium Applications Manager. Hisert is responsible for exploring and leveraging the use of indium in various forms and applications. He will

Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or

Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria and Switzerland, and Karthik Vijay, Technical Manager, Europe, Africa and the Middle East, will

Indium Corporation's high-purity indium is refined using advanced processes that are controlled with rigorous quality standards. Purity is verified using advanced analytical instrumentation such

Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in

Indium Corporation, Utica’s Technology Company®, will host a job fair for more than 30 open full-time positions on October 19 from 10:30 a.m.-6 p.m. at the Radisson Hotel-Utica Centre, 200

Indium Corporation’s Dr. Yan Liu, Research Chemist, will present at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste Series to help customers Avoid the Void® at Productronica, November 14-17, in Munich, Germany. The