プレスリリース

Indium Corporation, Utica’s Technology Company®, is now accepting applications for the company’s college summer Internship Program. Applications will be accepted from now through

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany.

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany Indium Corporation is redefining solder

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany.

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany. Indium Corporation is redefining solder

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics

Indium Corporation, Utica’s Technology Company®, has partnered with the Workforce Development Board to become a host employer for the Career Pathways for Youth (CPY) program. As part of

Indium Corporation has hired Tim Twining as the company’s new Vice President, Marketing. Twining is responsible for leading the development, implementation, and oversight of Indium

Indium Corporation’s Joe Bahou, Technical Sales Support Engineer, West Coast, will present at SMTA San Diego’s Chapter Meeting on March 8 in Poway, Calif. Bahou will

Indium Corporation, Utica’s Technology Company®, has promoted Ed Briggs to Senior Materials Engineer and hired Anthony Laria as Global ERP Operations Manager. In his new role, Briggs

Indium Corporation’s Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International Conference and

Indium Corporation will feature its precision gold alloy solder preforms at SPIE Defense + Commercial Sensing Expo, April 9-13, in Anaheim, Calif. Depending on the alloy, gold-based solders

Indium Corporation will feature its Ball-Attach Flux WS-575-C-RT at Productronica China from March 14-16, 2017, in Shanghai. Indium Corporation's Ball-Attach Flux

Indium Corporation has been named winner of the annual CIRCUITS ASSEMBLY Service Excellence Award for Materials at the IPC APEX Expo technical conference on February 14-16 in San

Indium Corporation will feature its metal thermal interface materials for burn-in, including Heat-Spring® and HSMF-OS, at Burn-in & Test Strategies Workshop on March

Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials. Nash is responsible for managing new solder paste product development, including strategy

Seven Indium Corporation partners will exclusively run its low-voiding solder products "Live@APEX" throughout the IPC APEX Expo technical conference on Feb. 14-16 in San

ウティカのテクノロジー・カンパニー®であるインジウム・コーポレーションは、12月現在、勤続10年以上の61名の従業員の勤続を祝っている。

Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen,

Indium Corporation has named Jim Hisert as Indium Applications Manager. Hisert is responsible for exploring and leveraging the use of indium in various forms and applications. He will

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla. InFORMS are reinforced solder preforms that increase