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Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Eric Bastow, Assistant Technical Manager for the Americas, will present at the 2017 SMTA Puget Sound Symposium and

Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 Solder Pastes to help customers Avoid the Void® at NEPCON China 2017 from April 25-27, in

Indium Corporation and SMT will host a joint seminar on May 5 in Shanghai featuring technical discussions on Materials and Equipment Selection for High-Reliability Automotive

Indium Corporation featured its low-voiding solder products “Live@Productronica China” at Productronica China from March 14-16, 2017, in Shanghai.      

Indium Corporation’s Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop on April 26-27,

Indium Corporation, Utica’s Technology Company®, has promoted Brandon Judd and hired Benjamin Rolewicz and Mike Wood as Manufacturing Process Engineers at the company’s Business Park

Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon) April 29-May 4 in Providence,

Indium Corporation's Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the 2017 Automotive Electronics Council (AEC)

Indium Corporation delivers a single-source solution, from mine to packaging, for high-purity tin materials. The company offers tin in a number of physical forms and purity levels of up to 5N or

Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16

Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at ICEP 2017 on April 19-22 in Tendo, Japan. Lim’s presentation, Benchmarking Study for

Indium Corporation, Utica’s Technology Company®, is now accepting applications for the company’s college summer Internship Program. Applications will be accepted from now through

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany.

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany Indium Corporation is redefining solder

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste to help customers Avoid the Void® at SMT Hybrid Packaging May 16-18, in Nuremberg, Germany.

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe 2017, May 16-18, in Nuremberg, Germany. Indium Corporation is redefining solder

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, and other company experts will present at SMTA’s South East Asia Technical Conference on Electronics

Indium Corporation, Utica’s Technology Company®, has partnered with the Workforce Development Board to become a host employer for the Career Pathways for Youth (CPY) program. As part of

Indium Corporation has hired Tim Twining as the company’s new Vice President, Marketing. Twining is responsible for leading the development, implementation, and oversight of Indium

Indium Corporation’s Joe Bahou, Technical Sales Support Engineer, West Coast, will present at SMTA San Diego’s Chapter Meeting on March 8 in Poway, Calif. Bahou will

Indium Corporation, Utica’s Technology Company®, has promoted Ed Briggs to Senior Materials Engineer and hired Anthony Laria as Global ERP Operations Manager. In his new role, Briggs