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Joey writes: Dear Dr. Ron, I have a stencil aperture with an unusual shape. See Figure 1. How do I calculate the area ratio? The stencil thickness is 5 mils. The dimensions of the aperture are also

삼염화인듐이란 무엇이며 왜 중요한가요? 삼염화 인듐(화학식 InCl3)은 (인듐 원자가 +3 산화 상태에 있기 때문에) 염화 인듐(III)이라고도 합니다.

인듐 원자가 +3 산화 상태에 있기 때문에 인듐 (III) 염화물이라고도 하는 삼염화 인듐(화학식 InCl3)은 인듐 다음으로 가장 널리 사용되는 인듐 화합물입니다.

At Indium Corporation, we get a lot of questions about solder paste – its composition, its application, and best practice advice.Many of those questions often involve inquiries aboutthe metal

여러분, SMT 공정 엔지니어에게 있어 인생에서 두 번째로 중요한 티크트로픽 소재는 솔더 페이스트입니다. 만약 솔더 페이스트가 티크트로픽 성질을 띠지 않는다면, 인쇄하기 어려울 뿐만 아니라 아마도

이전 블로그 시리즈에서는 리플로 프로파일링을 위해 인쇄 회로 기판(PCB)에 열전대를 부착하는 모범 사례 몇 가지에 대해 설명했습니다. 오늘은 이 시리즈를 마무리하며 몇 가지 추가 정보를 알려드리겠습니다.

In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a

As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.

밀로쉬 라지치와의 대화를 마무리하기 위해 오늘 다시 돌아왔습니다. 처음 세 부분을 놓치셨다면 여기에서 다시 시작 부분으로 돌아가세요. Jim: 이 자료에 대해 어떤 점이 흥미로우신가요?

Yesterday, in Part 2 ofour interview, Miloš mentioned how using a hybrid solid/liquid TIM provides benefits over thermal grease. Today we discuss the challenges to working with liquid metal,

In yesterday’s post, Miloš and I discussed what he’s been working on in the

I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and

It may seem obvious that we need dimensions on an engineering drawing to specify a solder preform, but we often receive drawings with missing dimensions or tolerances. I’m guilty of that too

Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection

처음 QFN 보이드에 대해 접했을 때는 플럭스에서 가스가 빠져나가면 갇힌 공기 주머니가 생겨 신뢰성 문제를 일으키는 간단한 문제인 것처럼 보였습니다. 하지만 이후 저는

For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability. Typical applications for 80Au20Sn in die-attach

Folks, Let’s assume your company has decided that transfer efficiency (TE) is the key metric in determining solder paste quality. Transfer efficiency is the ratio of the volume of the solder

Low-temperature solders can have a wide variety of reflow profiles. One of the great things about Durafuse® LT is that it opens up an entirely new set of options for combining low oven

Flux charring isan undesirable cosmetic defect and one of the more common issues in hand and robotic soldering operations. There are multiple factors that can contribute to the charring of flux in

Michel writes: Dr. Ron, when if comes to SMT printing of solder paste, why do some people use the five-ball rule for rectangular apertures and the eight-ball rule for circular apertures? Michel: The

When you are choosing a low temperature solder alloy, there are some key properties that you should to consider. The first, and most important, is the melting temperature.This is commonly referred to