部落格

Joey writes: Dear Dr. Ron, I have a stencil aperture with an unusual shape. See Figure 1. How do I calculate the area ratio? The stencil thickness is 5 mils. The dimensions of the aperture are also

什麼是三氯化铟，為什麼它很重要？三氯化铟（化学式 InCl3），也称为氯化铟 (III)（因为铟原子处于 +3 氧化态）。

三氯化铟 (化學式 InCl3)，也稱為氯化铟 (III)（因為铟原子處於 +3 氧化狀態）是繼铟之後最普遍的铟化合物。

At Indium Corporation, we get a lot of questions about solder paste – its composition, its application, and best practice advice.Many of those questions often involve inquiries aboutthe metal

各位，對 SMT 製程工程師而言，焊膏是他們工作中第二重要的觸變性材料。如果焊膏不具備觸變性，不僅難以印刷，而且很可能

在本系列部落格之前，我們討論了一些將熱電偶連接至印刷電路板 (PCB) 以進行回流剖面分析的最佳做法。今天，我將以以下幾點來結束這個系列

In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a

As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.

我們今天回來完成與 Miloš Lazić 的對談。如果您錯過了前三個部分，請隨時跳回這裡開始。吉姆：您對這份材料感興趣的地方

昨天，在我們訪談的第二部分中，米洛什提到使用固液混合型熱界面材料（TIM）相較於導熱膏具有哪些優勢。今天我們將探討使用液態金屬時所面臨的挑戰，

In yesterday’s post, Miloš and I discussed what he’s been working on in the

I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and

It may seem obvious that we need dimensions on an engineering drawing to specify a solder preform, but we often receive drawings with missing dimensions or tolerances. I’m guilty of that too

Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection

當我第一次接觸 QFN 空洞問題時，它似乎是一個簡單直接的問題：助焊剂的放氣會產生夾雜空氣的氣孔，造成可靠性問題。但我後來發現

For the plethora of applications that require a high-melting die-attach solder, 80Au20Sn is a great choice to ensure good performance and reliability. Typical applications for 80Au20Sn in die-attach

Folks, Let’s assume your company has decided that transfer efficiency (TE) is the key metric in determining solder paste quality. Transfer efficiency is the ratio of the volume of the solder

Low-temperature solders can have a wide variety of reflow profiles. One of the great things about Durafuse® LT is that it opens up an entirely new set of options for combining low oven

Flux charring isan undesirable cosmetic defect and one of the more common issues in hand and robotic soldering operations. There are multiple factors that can contribute to the charring of flux in

Michel writes: Dr. Ron, when if comes to SMT printing of solder paste, why do some people use the five-ball rule for rectangular apertures and the eight-ball rule for circular apertures? Michel: The

When you are choosing a low temperature solder alloy, there are some key properties that you should to consider. The first, and most important, is the melting temperature.This is commonly referred to