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Joey writes: Dear Dr. Ron, I have a stencil aperture with an unusual shape. See Figure 1. How do I calculate the area ratio? The stencil thickness is 5 mils. The dimensions of the aperture are also

什么是三氯化铟，为什么它很重要？三氯化铟（化学式 InCl3），又称氯化铟（III）（因为铟原子处于 +3 氧化态），是

三氯化铟（化学式 InCl₃），也称为氯化铟（III）（因为铟原子的氧化数为+3），是化合物 铟化合物 最常见的铟化合物

At Indium Corporation, we get a lot of questions about solder paste – its composition, its application, and best practice advice.Many of those questions often involve inquiries aboutthe metal

各位，对于表面贴装技术 工程师来说，焊膏是他们工作中第二重要的触变性材料。如果焊膏不具备触变性，不仅难以印刷，而且很可能

Previously in this blog series,we discussed some of the best practices for attaching thermocouples to a printed circuit board (PCB) for reflow profiling. Today, I will end this series with a few more

In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a

As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.

今天，我们将继续完成与米洛什-拉齐奇的对话。如果您错过了前三部分，请点击这里回到开头。吉姆您对这份材料的哪些方面感兴趣？

昨天，在我们采访的第二部分中，米洛什提到了使用固液混合型热界面材料（TIM）相比导热硅脂具有哪些优势。今天，我们将探讨使用液态金属时面临的挑战，

In yesterday’s post, Miloš and I discussed what he’s been working on in the

I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and

It may seem obvious that we need dimensions on an engineering drawing to specify a solder preform, but we often receive drawings with missing dimensions or tolerances. I’m guilty of that too

Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection

当我第一次接触QFN 空洞率时，它看起来是个很简单的问题：助焊剂的脱气会形成被困的气泡，从而导致可靠性 。但后来我逐渐意识到……

对于大量应用 高熔点芯片焊料应用 ，80Au20Sn 是一个绝佳的选择，可确保良好的性能和可靠性。80Au20Sn应用 芯片典型应用

Folks, Let’s assume your company has decided that transfer efficiency (TE) is the key metric in determining solder paste quality. Transfer efficiency is the ratio of the volume of the solder

Low-temperature solders can have a wide variety of reflow profiles. One of the great things about Durafuse® LT is that it opens up an entirely new set of options for combining low oven

Flux charring isan undesirable cosmetic defect and one of the more common issues in hand and robotic soldering operations. There are multiple factors that can contribute to the charring of flux in

Michel writes: Dr. Ron, when if comes to SMT printing of solder paste, why do some people use the five-ball rule for rectangular apertures and the eight-ball rule for circular apertures? Michel: The

When you are choosing a low temperature solder alloy, there are some key properties that you should to consider. The first, and most important, is the melting temperature.This is commonly referred to