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Joey writes: Dear Dr. Ron, I have a stencil aperture with an unusual shape. See Figure 1. How do I calculate the area ratio? The stencil thickness is 5 mils. The dimensions of the aperture are also

三塩化インジウムとは何か、なぜ重要なのか？三塩化インジウム（化学式InCl3）は、インジウム（III）塩化物（インジウム原子の酸化状態が＋3であるため）とも呼ばれる。

三塩化インジウム（化学式InCl3）は、インジウム（III）塩化物（インジウム原子の酸化状態が＋3であるため）とも呼ばれ、インジウム（III）化合物の中でインジウム（III）化合物の次に多く使用されている。

At Indium Corporation, we get a lot of questions about solder paste – its composition, its application, and best practice advice.Many of those questions often involve inquiries aboutthe metal

Folks, To the SMT process engineer, the second most important thixotropic material in their lives is solder paste. If solder paste was not thixotropic, it would be difficult to print and would likely

前回までこのブログシリーズでは、リフロー・プロファイリングのためにプリント基板（PCB）に熱電対を取り付ける際のベストプラクティスをいくつかご紹介しました。本日は、このシリーズの最後を飾るにふさわしい

In order to get an accurate reflow profile of a Printed Circuit Board (PCB), it is important to keep best practices for attaching thermocouples in mind. The first thing to remember is that a

As discussed in a previous blog post, it is important to followbest practices for attaching thermocouples to a printed circuit board (PCB) toaccurately measure the reflow profile of an assembly.

ミロシュ・ラジッチとの対談を終えるために、今日もまた戻ってきました。前3回をお聞きになれなかった方は、こちらからどうぞ。ジムこの資料のどこに興味を持ちましたか？

Yesterday, in Part 2 ofour interview, Miloš mentioned how using a hybrid solid/liquid TIM provides benefits over thermal grease. Today we discuss the challenges to working with liquid metal,

In yesterday’s post, Miloš and I discussed what he’s been working on in the

I recently caught up with Miloš Lazić,one of our Technical Support Engineers who has taken a special interest in liquid metals. In the lab, Miloš has been experimenting with and

はんだプリフォームの仕様を定めるには、設計図に寸法が必要なのは当然のことのように思えるかもしれませんが、寸法や公差が記載されていない図面が頻繁に送られてきます。私自身もその過ちを犯したことがあります

Scanning Electron Microscopy (SEM) is a technique used to characterize cross sections of solder joints to identify a root cause to a soldering failure. Although there are many different detection

私が初めてQFNのボイド発生について紹介されたとき、それは単純な問題のように思われました。フラックスからのアウトガスが、閉じ込められた空気のポケットを作り、信頼性の問題を引き起こすのです。しかし、私はそれ以来

高融点ダイ・アタッチはんだを必要とする多くの用途において、80Au20Snは優れた性能と信頼性を保証する優れた選択肢です。ダイ・アタッチにおける80Au20Snの代表的な用途

Folks, Let’s assume your company has decided that transfer efficiency (TE) is the key metric in determining solder paste quality. Transfer efficiency is the ratio of the volume of the solder

Low-temperature solders can have a wide variety of reflow profiles. One of the great things about Durafuse® LT is that it opens up an entirely new set of options for combining low oven

Flux charring isan undesirable cosmetic defect and one of the more common issues in hand and robotic soldering operations. There are multiple factors that can contribute to the charring of flux in

Michel writes: Dr. Ron, when if comes to SMT printing of solder paste, why do some people use the five-ball rule for rectangular apertures and the eight-ball rule for circular apertures? Michel: The

When you are choosing a low temperature solder alloy, there are some key properties that you should to consider. The first, and most important, is the melting temperature.This is commonly referred to