Indium Corporation will feature NC-SMQ®75 die-attach solder paste at Productronica China March 17-19, 2015, at the Shanghai New International Expo Centre in Shanghai, China.
NC-SMQ75 is an ultralow residue, halogen-free, die-attach solder paste that leaves a completely benign, almost undetectable, residue of approximately 0.4 weight percent of paste. It is designed for reflow in a nitrogen or forming gas atmosphere of 100 ppm oxygen or less and can survive the high temperatures associated with both high-lead (Pb) and gold-tin alloy reflow.
This product is designed to eliminate the cleaning step in power semiconductor assembly, especially in clip-bonding and similar applications that do not use a wirebond. The post-reflow residue has been certified "Power-Safe" and approved to MSL1, 2, and 3 by multiple customers in Asia.
Indium Corporation will be at booth 1368 in Hall E1 at Productronica China.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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