Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, shared his expertise during two professional development courses at the 19th International Conference on Electronic Packaging Technology (ICEPT 2018) on Aug. 8 in Shanghai, China.
Achieving High Reliability for Lead-Free Solder Joints – Materials Consideration detailed the material considerations required for achieving high-reliability in lead-free solder joints. The goal of this course was to provide participants with the understanding of how various factors contribute to failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
The second course, Power Electronic Packaging Reliability, Materials, Assembly and Simulation, educated participants on the lead-free materials best used to achieve high-reliability solder joints in power electronics at varying temperatures.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
