球體是我用來測試焊料潤濕特性最多的铟，因為它們有精確的體積。(與噴丸不同，噴丸沒有嚴格控制的尺寸或球度限制)。球體常用於倒裝晶片連接和 BGA 裝置的互連。我們也提供與銀等其他元素合金化的球體。合金化铟通常会使材料变硬并降低其冷焊能力。
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