Indium Corporations Ron Lasky, Ph.D., PE, senior technologist, will host a webinar on intermetallics and their importance to solder joints on Tuesday, Sept. 21, 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany as part of the companys free webinar program, the InSIDER Series.
The formation of copper-tin intermetallics is fundamental to a functional solder joint. In creating most solder joints, two pieces of copperwhich melt at 1085Care bonded together with solder, at less than 250C.
Most of us, with years of experience in electronic assembly, dont usually think of this technological miracle of soldering. We are able to bond two pieces of copper together at a temperature low enough where the bonding can be performed in the presence of polymer material. Without this low-temperature formation of copper-tin intermetallics, the electronic industry might not exist, said Dr. Lasky. However, contemporary wisdom is that these intermetallics are brittle and can result in poor thermal cycle or drop shock performance.
In this webinar, Dr. Lasky will review the formation of copper-tin intermetallics, their growth rate, their effect on thermal cycle life, and drop shock performance. The brittle nature of copper-tin intermetallics will also be discussed. In addition, several graphs of intermetallic growth rate will be presented. Some of the additional ancillary effects of copper-tin intermetallic growthsuch as tin whiskers and their mitigationwill also be discussed.
Dr. Laskys webinar is offered as part of Indium Corporations free webinar program, the InSIDER Series. You can register for his webinar at https://indium.news/3zosh98.
Dr. Lasky is a senior technologist at Indium Corporation, as well as a professor of engineering and the director of the Lean Six Sigma program at Dartmouth College in Hanover, N.H., U.S. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering, and science and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of Surface Mount Technology Associations (SMTA) SMT Process Engineering Certification program and exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded SMTAs Founders Award in 2003.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
