Indium Corporation’s Dr. Ron Lasky, Senior Technologist, will host an Avoid the Void® workshop on how to avoid voiding in bottom terminated components (BTCs) on Thursday, June 11 at 9 a.m. and 2 p.m. EST on Indium Corporation’s webinar program, the InSIDER Series.
BTCs are one of the most common packages in electronics today with the highest growth rate due to their small size, excellent electrical performance, and ability to transfer heat away from the integrated circuit (IC). In his workshop, Understand and Troubleshoot Voiding in Bottom Terminated Components, Dr. Lasky will discuss how voids form in QFNs and how to minimize them. He’ll also cover factors that affect voiding, such as stencil design, stencil thickness, reflow profile, solder paste particle size, and solder pastes. The use of solder preforms to minimize voiding will also be presented.
Dr. Lasky’s workshop is offered as part of Indium Corporation’s free webinar program, the InSIDER Series. Register for his workshop here. All of Indium Corporations webinars can be found at https://www.indium.com/webinar.
Dr. Lasky is a Senior Technologist at Indium Corporation, as well as a Professor of Engineering and the Director of the Lean Six Sigma program at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronics packaging at IBM, Universal Instruments, and Cookson Electronics. Dr. Lasky has authored six books, and contributed to nine more, on science, electronics, and optoelectronics, and has authored numerous technical papers. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry worldwide. Dr. Lasky was awarded the Surface Mount Technology Association’s Founder’s Award in 2003. Dr. Lasky holds four degrees, including a Ph.D. from Cornell University in materials science, and is a licensed professional engineer.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
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