Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, will share his technical expertise at the CEIA Qingdao Seminar on June 23 in Qingdao, Shandong, China.
Liao’s presentation, QFN Voiding Investigations and Solutions, will explore various methods to reduce voiding in bottom termination components, including:
- 0402 or 0201 Solder Fortification® preforms
- Flux-coated preforms
- Optimized flux formulation
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than ten years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned a bachelor’s degree from Tianjin University in Mechanical and Electronics Engineering.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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