Indium Corporation’s Pony Liao, Area Technical Manager for Northern China, will share his technical expertise at the CEIA Qingdao Seminar on June 23 in Qingdao, Shandong, China.
Liao’s presentation, QFN Voiding Investigations and Solutions, will explore various methods to reduce voiding in bottom termination components, including:
- 0402 or 0201 Solder Fortification® preforms
- Flux-coated preforms
- Optimized flux formulation
Liao provides technical support for Indium Corporation’s electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He has more than ten years of experience in surface mount technology, specializing in defect prevention, quality continuous improvement, and cost reduction. Liao earned a bachelor’s degree from Tianjin University in Mechanical and Electronics Engineering.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、および熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
