Indium Corporations Leo Hu, senior area technical manager East China, will share his technical expertise on automotive electronics reliability trends at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
The evolution of the automobile over the past decade has been faster than ever before, and the 2020s promise even more rapid progress. With the development of hybrid and electric vehicles and autonomous driving, the number of wide band gap devicessuch as SiC and GaN modules and advanced driver assistance system sensorshave greatly increased in automotive electronics, as seen in the SiC metaloxidesemiconductor field-effect transistor inverter, infrared cameras, and short wavelength IR lidar, among other related electronic components. This trend will drive more rigorous reliability requirements for solder materials. In High-Reliability Solder Material Impact and Application on Automotive Electronic Assemblies, Hu will explore the development trends on the horizon for reliability demands within the automotive industry. He will also discuss Indium Corporations portfolio of high-reliability materials for automotive applications, including Indalloy292, a high-reliability alloy designed to meet the more rigorous temperature cycle test (-40C/+150C) and other relevant tests requirements. He will also explain the application of its reinforced matrixed solder composite, InFORMS, and silver sintering material QuickSinter.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a masters degree in IC engineering from the Chinese Academy of Science and a bachelors degree in electronic information science and technology from Nankai University, Tianjin, China.
For more information about Indium Corporations suite of proven products for automotive applications, visit www.indium.com/corporate/markets/#automotive or visit Indium Corporations booth.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
