Indium Corporation Expert to Present at Electronic Components and Technology Conference

Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Institute of Electrical and Electronics Engineers (IEEE) 68^th Electronic Components and Technology Conference (ECTC) from May 29 to June 1 in San Diego, California, USA.

Dr. Lee will lead the professional development course, Achieving High-Reliability of Lead-Free Solder Joints—Materials Considerations. The course is designed to help attendees understand the various factors of materials, thus enabling the best selection of the proper solder alloys and surface finishes for achieving high-reliability solder joints.

Dr. Lee will present Nano-Cu Sintering Paste for High Power Devices Die Attach Applications. The paper examines how a nano-Cu pressureless sintering paste, developed specifically for joint formation applications, performed when subjected to a variety of tests for oxidation resistance.

Dr. Lee is also presenting Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications. His interactive presentation reports on the development, testing, and results of Indalloy^®276, a lead-free solder alloy created to target wide service temperatures with high reliability.

Lee 博士是世界知名的焊接專家、SMTA 優秀會員和 IEEE 會員。他在 SMT 用助焊劑、合金和焊膏的開發方面擁有豐富的經驗，在高溫聚合物、微電子封裝劑、填充劑和粘合劑的開發方面也有廣泛的經驗。除了 SMT 和半導體焊接材料之外，他的研究還延伸到奈米接合技術和導熱材料。

A paper co-authored by Indium Corporation’s Francis Mutuku, Research Metallurgist, will also be presented at the conference.

For more information about Indium Corporation’s experts and their work, visit  https://www.indium.com/techlibrary.

Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。

如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer To^Another®(#FOETA)。