Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen, Germany.
Karch will present Miniaturization: Solder Paste Attributes for Maximizing the SMT Print and Reflow Manufacturing Process Window, which details the development of a flux technology platform to achieve print consistency by maximizing paste transfer and minimizing deviation for small apertures (sub-300 microns diameter, area ratios of 0.5-0.6); eliminate HIP with an enhanced oxidation barrier approach, as opposed to just making a flux more active; achieve complete solder coalescence and prevent clumpy solder joints; and achieve very low-voiding.
Karch 提供支援，包括分享製程知識，並針對 Indium Corporation 材料的使用提出技術建議，包括焊膏、預成型焊料、助焊剂和熱管理材料。Karch 擁有超過 20 年的汽車產業經驗，包括客製化電子產品的先進開發。他是 ECQA 認證的整合設計工程師，並擁有六標準差黃帶資格。奧地利專利局還將他選為 2014 年汽車 LED 組件十大 Inventum 獎得主之一。Karch 對製程技術和專案管理技能保持著深入的瞭解。
InnovationsFORUM is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
