Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at the EPP InnovationsFORUM on March 9 in Böblingen, Germany.
Karch will present Miniaturization: Solder Paste Attributes for Maximizing the SMT Print and Reflow Manufacturing Process Window, which details the development of a flux technology platform to achieve print consistency by maximizing paste transfer and minimizing deviation for small apertures (sub-300 microns diameter, area ratios of 0.5-0.6); eliminate HIP with an enhanced oxidation barrier approach, as opposed to just making a flux more active; achieve complete solder coalescence and prevent clumpy solder joints; and achieve very low-voiding.
Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
InnovationsFORUM is an event for electronics manufacturers to learn the most advanced technologies, materials, and processes.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
