Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will present on liquid metal interface technology during IMAPS France’s 14th European Advanced Technology Workshop on Micropackaging and Thermal Management, Feb. 6-7 in La Rochelle, France.
Jensen’s presentation, Innovative Liquid Metal Interface Technology for TIM2 Applications, will examine methodologies and techniques that can enable liquid metal to be used in a higher array of TIM2 applications. Jensen will also address factors limiting the adoption of liquid metal TIMS, including the difficulty of applying a significant amount of liquid metal in high volume and containing the liquid metal under the heat-sink.
Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers to troubleshoot and optimize SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, and thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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