Indium Corporation’s Jonathan Minter, Research and Development Metallurgy Technician, will present at the TMS 2018 Annual Meeting & Exhibition on March 11-15 in Phoenix, Ariz.
High-Pb solders have been used as die-attach materials for decades in discrete power packages. Due to the known harmful effects of Pb to human health and the environment, and the demand of SiC power device serving under higher junction temperature, alternative Pb-free materials have been studied intensively. However, Pb-free alternatives for die-attach applications are still in the infant age, and no well-recognized drop-in solution is available yet.
Minter’s presentation, High Temperature Lead-free Die Attach Materials, will review the potential materials/technologies for high-temperature Pb-free die-attach, including solders, sintering materials, and solid-liquid interdiffusion materials/technology.
Minter joined Indium Corporation in 2015 and is responsible for supporting the development and testing of high-temperature Pb-free solder paste alloys. He earned a bachelor’s degree in chemistry and a master’s degree in chemistry (adolescence education) from SUNY Cortland.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
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