Indium Corporation’s Jonathan Minter, Research and Development Metallurgy Technician, will present at the TMS 2018 Annual Meeting & Exhibition on March 11-15 in Phoenix, Ariz.
High-Pb solders have been used as die-attach materials for decades in discrete power packages. Due to the known harmful effects of Pb to human health and the environment, and the demand of SiC power device serving under higher junction temperature, alternative Pb-free materials have been studied intensively. However, Pb-free alternatives for die-attach applications are still in the infant age, and no well-recognized drop-in solution is available yet.
Minter’s presentation, High Temperature Lead-free Die Attach Materials, will review the potential materials/technologies for high-temperature Pb-free die-attach, including solders, sintering materials, and solid-liquid interdiffusion materials/technology.
Minter joined Indium Corporation in 2015 and is responsible for supporting the development and testing of high-temperature Pb-free solder paste alloys. He earned a bachelor’s degree in chemistry and a master’s degree in chemistry (adolescence education) from SUNY Cortland.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
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