Two Indium Corporation experts will present at the 2019 IEEE 69th Electronic Components and Technology Conference, May 28-31, in Las Vegas, Nevada.
Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional development course on Achieving High Reliability of Lead-Free Solder Joints—Materials Consideration. This course will show participants how various factors can contribute to failure modes, as well as how to select proper solder alloys and surface finishes for achieving high-reliability.
Dr. Sihai Chen, Research Chemist, will present his interactive poster, Highly Reliable Die-Attach Silver Joint with Pressureless Sintering Process. The presentation reviews the development and testing of pressureless high-reliability silver sintering pastes designed for silver joint optimization.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and an IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for the SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Dr. Chen specializes in silver sintering paste product development. He has authored several Indium Corporation patents for silver sintering paste, thermal interface material, heat dissipating paint, and indium bump bonding. Dr. Chen has published in numerous journals, including the Journal of the American Chemical Society, Nano Letters, Langmuir, and The Journal of Physical Chemistry. He earned his doctorate in Chemistry from the Chinese Academy of Sciences with a focus on metal and semiconductor nanomaterial synthesis. Dr. Chen also holds a Six Sigma Green Belt and has been certified as an IPC Specialist for IPC-A-610.
To view additional papers authored by Drs. Lee and Chen, as well as other Indium Corporation experts, visit indiumstg.wpenginepowered.com/techlibrary.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
