Indium Corporation將於 7 月 10-12 日在英國劍橋舉行的IMAPS High Temperature Electronics Network 2017 (HiTEN 2017) 上展出其半導體級金锗焊料預製件。
半導體級預型件的設計是為了因應 RF 和功率半導體裝置持續變小所面臨的挑戰。
Indium Corporation 的高熔點 AuGe 焊料預型件在功率密度增加的小型裸片的高工作溫度下表現良好。此外，濕潤度的改善使半導體級 AuGe 焊料預型件成為減少空隙的關鍵。
金基焊料的熔點範圍為 280-1064°C，因此與後續的回流焊製程相容。此外，金基焊料還具有耐腐蝕性、優異的耐熱疲勞性以及出色的接合強度。
Indium Corporation’s Pb-free and RoHS-compliant preforms are available in a variety of standard and custom-engineered designs. For more information about Indium Corporation’s gold alloy solder preforms, visit indiumstg.wpenginepowered.com/brazealloys.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
