Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2017 in Taipei, Taiwan.
Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
- Good response-to-pause
- Wide reflow profile window
- Outstanding slump resistance
- Excellent wetting capability
- Superior fine-pitch soldering ability
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, go to indiumstg.wpenginepowered.com/SiP or visit Indium Corporation’s booth 2412.
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
