Indium Corporation will feature its ultra-reliable Indium8.9HF-1 Solder Paste at NEPCON Asia, August 28-30, in Shenzhen, China.
Indium Corporations Indium8.9HF-1 is specially formulated to deliver outstanding voiding performance for highly-reliable bottom-terminated components (BTC) in 5G wireless infrastructure applications. Indium8.9HF-1 also delivers a soft, pliable, post-reflow flux residue designed to stay probe-testable, resulting in unprecedented in-circuit testing (ICT) and flying-probe testing in first pass yields.
Indium8.9HF-1is a Pb-free, no-clean solder paste intended for both air and nitrogen reflow that produces fewer false testing failures, which gives you faster cycle times and less rework. It also provides peace of mind, delivering high-reliability assemblies with:
- High oxidation barrier that eliminates graping and HIP defects
- Excellent print transfer efficiency
- Superior void minimization performance
For more information about Indium8.9HF-1 Solder Paste and other high-reliability solder products for 5G assemblies, please visit indiumstg.wpenginepowered.com/avoidthevoid or stop by booth #1L25 at the show.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another (#FOETA), at www.facebook.com/indium or @IndiumCorp.
