Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), March 30, and made available for on-demand viewing afterward.
Reflowed indium metal has for decades been the standard for sTIMs in most high-performance computing (HPC) TIM1 applications. The IEEE heterogeneous integration thermal roadmap states that new thermal interface material solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed sTIMs in both CPU and GPU “die to lid/heat spreader” (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses.
In this webinar, Mayberry will present on the effects of reflow methodology, solder flux type/fluxless processing, and preform design parameters, such as alloy type. Data will be provided on various reflow processes including pressure (autoclave) and vacuum reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultra-low voiding. The use of sTIMs in the context of alternative TIM applications and technologies, such as thermal greases, pads, and phase change materials, as well as liquid metals, will also be considered.
You may register for Mayberry’s webinar here. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.
As a technical support engineer, Mayberry is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. Prior to Indium Corporation, he was a R&D scientist for a global metallization paste business, where he developed novel glass and paste metallization compositions tailored for emerging technologies. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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