As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
Indium Corporation 將展示下列特色產品：
- SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporations SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
- PicoShot NC-6M is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
- NC-809 is Indium Corporations first no-clean, ultra-low residue, ball-attach flux on the market. It is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
- NC-702A is a no-clean, near-zero residue, halogen-free, and SVHC-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702A environmentally friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes without the risk of delamination.
- WS-446HF, is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.
- Heat-Spring solutions, ideal for TIM1.5/TIM2/TIM3 applications, are a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes.
- GalliTHERM, a portfolio of gallium-based liquid metal solutions, draws on Indium Corporation’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for TIM1.5, TIM1, and TIM2 applications. Liquid metal TIMs offer high thermal conductivity for end-product longevity and reliability, low interfacial resistance against most surfaces, ensuring rapid heat dissipation, and extraordinary wetting ability for both metallic and non-metallic surfaces
To learn more about Indium Corporations products, visit our experts at IMAPS Boston at booth #321.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑；銅钎；熱介面材料；濺鍍靶材；铟、鎵、锗、錫金屬和無機化合物；以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以在www.linkedin.com/company/indium-corporation/ 追蹤我們的專家，From One Engineer To Another (#FOETA)。
