As one of the leading materials providers to the electronics assembly industry, Indium Corporation is proud to feature its innovative products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), from October 1-3, in Boston, Massachusetts.
インジウムコーポレーションは、注目製品の中から以下を展示する：
- SiPaste series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporations SiPaste C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.
- PicoShot NC-6M is a no-clean, halogen-free material specifically formulated to be compatible with Mycronic jetting systems. Chemically compatible with award-winning Indium12.8HF solder paste, PicoShot NC-6M is optimized for small dot jetting and long-term jetting with Type 6 solder paste. PicoShot NC-6M offers the smallest dot jetting volume among similar jetting pastes, at 1.6nL/dot. In addition to exceptional jetting performance, its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
- NC-809 is Indium Corporations first no-clean, ultra-low residue, ball-attach flux on the market. It is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications with strong wetting power for ball-attach applications.
- NC-702A is a no-clean, near-zero residue, halogen-free, and SVHC-free adhesive solution designed for holding chips, dies, or solder preforms in place to prevent skewing and tilting during placement and reflow processes. Its chemical design enables it to hold a die in place during reflow and evaporate out while formic acid is released to enhance soldering. Its halogen-free nature makes NC-702A environmentally friendly, as well. Its near-zero residue feature also makes it compatible with the subsequent molding or underfill processes without the risk of delamination.
- WS-446HF, is a water-soluble, halogen-free, flip-chip dipping flux with an activator system powerful enough to promote good wetting on the most demanding surfaces, including solder-on-pad (SoP), Cu-OSP, ENIG, embedded trace substrates (ETS), and flip-chip on leadframe applications.
- Heat-Spring solutions, ideal for TIM1.5/TIM2/TIM3 applications, are a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metalswith pure indium metal delivering 86W/mK in all planes.
- GalliTHERM, a portfolio of gallium-based liquid metal solutions, draws on Indium Corporation’s more than 60 years of experience in manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for TIM1.5, TIM1, and TIM2 applications. Liquid metal TIMs offer high thermal conductivity for end-product longevity and reliability, low interfacial resistance against most surfaces, ensuring rapid heat dissipation, and extraordinary wetting ability for both metallic and non-metallic surfaces
To learn more about Indium Corporations products, visit our experts at IMAPS Boston at booth #321.
インジウム・コーポレーションについて
インジウム・コーポレーション は、世界のエレクトロニクス、半導体、薄膜、サーマルマネージメント市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、Jingya HuangまでEメールにてお問い合わせください。また、当社の専門家、From One Engineer To Another (#FOETA)をフォローすることもできます。www.linkedin.com/company/indium-corporation/。
