Indium Corporation’s Vice President of Technology, Dr. Ning-Cheng Lee, will lead a professional development course during the 20th Electronics Packaging Technology Conference, Dec. 4-7 in Sentosa, Singapore.
Dr. Lee will be a course leader, alongside other industry experts, for the professional development course Power Electronic Packaging Reliability, Materials, Assembly, and Simulations. The course will cover power electronic packaging from manufacturing to testing, and provide guidance on on how to fully realize the efficiencies and potential cost-benefits of the microelectronic systems.
Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
