Indium Corporation‘s Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 11-14, 2010 in Santa Clara, CA.
Dr. Mackie is presenting Supply and Testing of Ultralow Alpha (<0.002cph/cm2) Assembly Materials as part of the session on wafer level packaging. In addition, Dr. Mackie is a member of the 2010 IWLPC technical committee and is also chairing a session for the 3D packaging track.
麥基博士在電子製造各領域擁有逾20年新產品與製程開發及材料行銷經驗，涵蓋晶圓製造、電子組裝及半導體封裝等領域。其專業領域涵蓋物理化學、表面化學、流變學、焊料材料特性與製程（含焊膏印刷技術）及回流焊接製程，為電子產業權威專家。
麥基博士因在焊膏工作組及組裝與接合材料分委員會的領導貢獻，於2001年榮獲IPC主席獎項。他接受過六西格瑪「實驗設計」的正式培訓，並在國際舞台發表論文及演講，研究主題涵蓋超臨界二氧化碳中的亞ppb金屬分析，乃至助焊劑殘留物的針探測試。 此外，麥基博士在新型聚合物、氣體分析及焊膏配方領域持有專利。
Dr. Mackie has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium’s global headquarters in Clinton, NY, USA. He is also the author of the Semiconductor / Power Semiconductor Assembly blog.
Sponsored jointly by the SMTA and Chip Scale Review Magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
For more information or to register for the conference, visit www.iwlpc.com.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料供應商。產品包括焊料、預成型 品和助熔劑；钎料；濺鍍靶材；铟、鎵和锗化學品和採購；以及 Reactive NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
如需有關 Indium Corporation 的更多資訊，請造訪www.indium.com或發送電子郵件至 [email protected]。
