Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger final solder joint.
This brief video features Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, and SMT process expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing the advantages of InFORMS. InFORMS are a fabrication in which braided, woven, or random-fiber metal substrate materials is embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate.
"The use of InFORMS provides confidence that the thermal performance will be repeatable from assembly to assembly, as well as across an individual assembly," Jensen said. "You don't have any part warping, or distortion of the part from hot spots in certain locations."
此視訊可在www.indium.com/blog/phil-zarrow 上找到。
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation's technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry.
Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
