Indium Corporation announces the release of its newest informational video that discusses InFORMS®, a revolutionary product designed to achieve uniform bondline thickness for a stronger final solder joint.
This brief video features Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solders, and SMT process expert Phil Zarrow, President and Principal Consultant for ITM Consulting, discussing the advantages of InFORMS. InFORMS are a fabrication in which braided, woven, or random-fiber metal substrate materials is embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate.
"The use of InFORMS provides confidence that the thermal performance will be repeatable from assembly to assembly, as well as across an individual assembly," Jensen said. "You don't have any part warping, or distortion of the part from hot spots in certain locations."
This video can be found at indiumstg.wpenginepowered.com/blog/phil-zarrow.
Jensen is an SMTA-certified process engineer. He has more than 15 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation's technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry.
Zarrow has been involved with PCB fabrication and assembly for more than 35 years. In addition to his background in automated assembly and cleaning, Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. His extensive hands-on experience also includes set-up and troubleshooting through-hole, and SMT processes throughout the world.
铟泰公司 面向全球电子、半导体、薄膜、热管理及太阳能市场的顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
