Indium Corporation’s Kenneth Thum, Senior Technical Support Engineer, will present Risk of No-Clean Flux Not Fully Dried Under Component Terminations at IPC Thailand on April 26 in Bangkok, Thailand.
Thum’s presentation will discuss a new halogen-free, no-clean SAC solder paste that has been developed to Avoid the Void® and to address the reliability issues caused by insufficiently dried or burnt-off flux residue.
Thum provides technical support and process troubleshooting expertise to Indium Corporation’s customers. His experience involves delivering yield improvements and enhanced supplier quality. Thum earned his bachelor’s degree in computer-aided design and computer-aided manufacturing from the University of Malaya. Additionally, he is an SMTA-certified process engineer.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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