Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indiums unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Indium8.9HF1-P has proven low cost-of-ownership for PCB assemblies, said Tim Jensen, Global Product Manager for Indium Corporations PCB assembly products. Our customers have been asking for a high-performance solder paste that combines excellent printability with probe-testability. This solder paste delivers on all counts. What this means is that Indium8.9HF1-P will deliver long-term reliability for our customers end products.
Indium8.9HF1-P provides high transfer efficiency, and consistent print performance, even at high speeds. Additionally this paste has a robust response-to-pause, lessening the need for frequent under-stencil wiping. Indium8.9HF1-P prints well on apertures with area ratios <0.5, using low print pressures. Indium Corporations unique oxidation barrier technology enhances reflow performance, eliminating defects such as head-in-pillow and graping.
Indium8.9HF1-P is optimized for probe-testability in two ways: it has a soft residue after reflow, which is easily penetrable by test probes, and this residue remains probe-testable after multiple reflows, time between reflow and test, and baking.
Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料、預成型品和助熔劑；銅钎；濺鍍靶材；铟、鎵和锗金屬和無機化合物；以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠位於中國、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
