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SIR 标准的细分

SIR Testing-Surface and Insulation Resistance testing,a form of standard testing where you measure the electrical reliability of a no-clean or a water-soluble flux residue, has existedfor a while now. Indium Corporation follows the IPC-TM-650 test standards. These standards are reviewed yearly, so we need to follow the most up-to-date SIR standard to back up our product’s reliability.

Below is a chart of a breakdown of SIR standards over the years that have changed. The SIR test method reference is 2.6.3.7 by IPC-TM-650. Our current standard is J-STD-004C and J-STD-004C optional testing.

参数

J-STD-004A

J-STD-004B

J-STD-004C

J-STD-004C

可选测试

温度和湿度

85°C, 85% 相对湿度, 168 小时

40°C, 90% 相对湿度

40°C, 90% 相对湿度

85°C, 85% 相对湿度

压力偏差

45 - 50 伏直流电

25 伏特/毫米

25 伏特/毫米

25 伏特/毫米

偏差前稳定期

T&H 3 小时

T&H 1 小时

T&H 1 小时

T&H 1 小时

测量偏差

-100伏直流电压

25 伏特/毫米(~5 伏特直流电压)

25 伏特/毫米(~5 伏特直流电压)

25 伏特/毫米(~5 伏特直流电压)

时间读数

24、96、168 小时

168 小时

168 小时

168 小时

Requirements of J-STD-004C and J-STD-004C Optional Testing SIR’s Report:

  • 说明是否需要清洁。
  • Document the cleaning procedure used in preparing the SIR coupons.
  • Disclose the thermal profile or solder pot temperature and preheat the temperature.
  • 披露 IPC-4101 规定的类型或电路板层压材料的玻璃转化温度 (Tg)。

As we further enter the world of EVs and develop smaller electronics, we are leaning towards J-STD-004C optional testing to test our high-reliability solder paste. The reason is to ensure that our solder paste can survive in electronics that require higher temperatures and carry out a good performance at the same time. Challenges and changes are constant so we will continuously adapt to the new standards.

If you have any questions about SIR performance and testing, please reach out to me or any of our Indium Corporation team members at [email protected]. We will be happy to help.