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Indium Corporation Expert to Present at PCIM and SMT Hybrid Packaging 2017

Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, will present at PCIM Europe 2017 and SMT Hybrid Packaging on May 16 in Nuremberg, Germany.

Karch will present Performance of Current Flux Systems in Solder Pastes to Increase the Electrical Reliability of Assemblies. He will discuss solder paste flux systems, solder paste performance, and the addition of solder volume for pin-in-paste using Solder Fortification® preforms.

Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation's materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂;硬钎焊;热界面材料;溅射靶材;铟、镓(Ga)、锗和锡等金属及化合物;以及NanoFoil®。铟泰公司成立于1934年,拥有全球技术支持网络,并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。

如需了解铟泰公司更多信息,请访问indiumstg.wpenginepowered.com或发送电子邮件[email protected]。您还可以通过www.facebook.com/indium@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”(#FOETA)。