Indium Corporation’s Senior Technical Support Engineer Chris Nash will present his technical findings at SMTA’s Capital Chapter meeting on May 17, 2011, at Johns Hopkins University’s Applied Physics Laboratory in Laurel, MD. Chris’s presentation, Soldering Challenges in a Halogen-Free PCB Assembly Process, will include the difference between halogen-free and halide-free, name the key industry specifications for halogen-free, and explain the typical problem a halogen-free process might encounter. Chris provides comprehensive technical advice in the selection, use, and application of solder paste, flux, and solder alloy fabrications to customers in the electronics assembly, optoelectronic, semiconductor, and related industries. He has authored numerous process and technical guidelines and has presented at several industry forums and conferences. Chris is a member of the SMTA and participates actively in the occasional IPC standards development committee. Chris has a bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green-Belt from Dartmouth College’s Thayer School of Engineering. He has earned his certification as an SMTA Process Engineer and is a certified IPC-A-600 and IPC-A-610D Specialist. For more information about SMTA, visit http://www.smta.org. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
