Indium Corporation’s Sze Pei Lim, technical manager – Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.
Sze Pei will present Alloy and Process Optimization for Low-Ag Solders, which reviews the critical challenges associated with SAC305 solder alloy, including high processing temperatures, high cost and price volatility, and poor resistance to mechanical shock. She will also discuss how doped low-Ag alloys can be used as a drop-in replacement to SAC305 with cost and reliability advantages.
Sehar will present Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues. This presentation discusses an experiment that studied the effect of reflow profiling on the electrical reliability of no-clean flux residues that can be measured using IPC J-STD-004[1] surface insulation resistance (SIR) testing. Both a halogen-free (ROL0) and a halogen-containing (ROL1) Pb-free no-clean solder paste, exposed to various reflow profiles, were used.
The IPC Southeast Asia High Reliability Conference is a one-day event featuring practical methodologies that can be deployed today. Industry experts representing every market sector will discuss solder technology, cleaning, test, and inspection strategies. For more information, visit www.ipc.org.
Sze Pei manages Indium Corporation’s technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.
Sehar provides field technical support to Indium Corporation’s customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in the factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the areas of process, failure analysis, and production. He earned his bachelor’s degree in electrical and computer engineering from the University of Texas and is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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