在处理高可靠性设备时，谨慎行事总是好的。
免清洗滚珠附着和封装在封装上的助焊剂通常设计为在回流焊后助焊剂残留物作为未使用活化剂的封装物之前达到一定温度。低于该温度时，大多数助焊剂都会因电迁移而无法通过SIR测试。一种独特的助焊剂（PoP 助焊剂 30b）在正常回流焊和较少见的未回流焊状态下都能通过SIR测试。大多数助焊剂在 150 摄氏度左右开始工作，需要 200 摄氏度左右的峰值温度才能通过IPC SIR测试。
我想我找到了我最喜欢的低温通心粉。
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